Application of Acoustic Frequency Domain Imaging for the Evaluation of Advanced Micro Electronic Packages

Acoustic micro imaging (AMI) is used as an important non-destructive inspection tool in semiconductor reliability evaluation and failure analysis. As advanced microelectronic packages are being produced smaller and thinner, detection of the internal features and defects in the packages are approaching the resolution limits for conventional AMI. Recently acoustic time-frequency domain imaging has been proposed by the authors to generate interface images with higher resolution. In this paper, acoustic time-frequency domain imaging is applied to real 3D RF data acquired from modern microelectronic packages. Experimental results in applications such as flip-chips and stacked dies are presented. The super resolution of acoustic time-frequency domain imaging is demonstrated by revealing more image details and enhancing image contrast in comparison with conventional time domain imaging.